G1136-1600WNA – 1600W High-Power CRPS PSU for Enterprise Servers and Storage
Features
CRPS-185: 185×73.5x40mm(LxWxH)
Input: 90 to 264Vac,180-300VdC
Hot-plug
Full Digital control
Active Power Factor Correction
Intelligent-thermal Fan Control
N+N N+1 Redundant
Reverse Airflow Option
Applications
Server
Storage
Networking
HPC
AI Data Centers
Cloud Computing
Enterprise IT Systems
Medical Imaging Equipment
Approvals
UL/cUL
CB
TuV-Mark
CCC/CQC
FCC
CE
NOM
BIS
Specifications
|
Output Power (W): |
1600 |
| Length (mm): |
185 |
|
Width (mm): |
73.5 |
| Height (mm): |
40 |
|
Mounting Type: |
Hot pluggable |
| Minimum Output Current (A): |
0 |
|
Maximum Output Current (A): |
133.3 |
| Output Voltage (V): |
12 |
|
Minimum Output Power (W): |
0 |
| Maximum Output Power (W): |
1600 |
|
Minimum Input Voltage (V): |
90 |
| Maximum Input Voltage (V): |
264 |
Model Selection Comparison Table
|
Model |
Power Tier | Output Current Profile | PMBus | Form Factor | Recommended Use |
| G1136-0550WNA | Balanced mid-range tier | 12V stable output profile | Yes | CRPS-class |
General compute, hybrid workloads |
| Upper mid-load tier | 12V heavier operations | Yes | CRPS-class | Storage + light AI nodes | |
| G1136-1200WNA | Performance compute tier | 12V accelerated load handling | Yes | CRPS-class |
Dense compute trays |
| High stability performance tier | 12V intensive continuous draw | Yes | CRPS-class | High-concurrency logic boards | |
| G1136-1600WNA | Power-rich tier | 12V heavy cluster operations | Yes | CRPS-class |
Compute-heavy + expansion scaling |
Deployment Scenarios
The G1136-1600WNA represents the upper-capacity configuration within the G1136 general-purpose series, designed for systems that require substantial power headroom while maintaining balanced behavior across compute, memory, and storage workloads.
It is well suited for enterprise servers, virtualization hosts, storage-integrated compute nodes, and mixed-role infrastructure platforms where workloads are stable but consistently active. This model is typically selected when platforms scale beyond mid-range power envelopes and demand predictable long-term operation without specializing toward a single workload type.
|
Scenario |
Deployment Behavior | Why 1600W Tier Fits |
| Enterprise servers | Continuous mixed load |
Strong sustained output |
|
Virtualization hosts |
High VM density | Reduced power saturation risk |
| Compute + storage nodes | Concurrent activity |
Balanced transient handling |
|
Private cloud platforms |
24/7 runtime | Designed for long duty cycles |
| Infrastructure services | Multi-role workloads |
Stable thermal characteristics |
|
General-purpose clusters |
Gradual scaling |
Comfortable growth margin |
Power Architecture & Reliability Design
The G1136-1600WNA represents the upper power envelope of the G1136 platform, engineered for deployments where sustained high current delivery, fast transient response, and long-term thermal stability are all required simultaneously. At the 1600W level, the power stage is optimized not just for peak output, but for maintaining electrical predictability under continuous near-limit operation common in GPU-dense servers, accelerator-heavy inference nodes, and high-concurrency compute clusters.
The reinforced LLC primary topology supports higher switching stress margins, allowing rapid recovery from large step-load events without inducing voltage droop on the 12V rail. This behavior is especially relevant during GPU kernel launches, AI training synchronization points, or container scale-up events where multiple subsystems ramp concurrently. Ripple remains tightly controlled under multi-rail contention, helping preserve PCIe negotiation stability, NVMe queue behavior, and memory controller timing during extended high-load windows.
Thermal design scales in parallel with electrical capacity. Heat dissipation paths are widened across the power stage and secondary rectification area, spreading thermal load more evenly across MOSFETs and magnetic components to avoid localized hotspots during prolonged operation. The fan control profile follows a progressive curve rather than reactive ramping, preventing abrupt acoustic changes while maintaining sufficient airflow headroom under sustained load.
In redundant 1+1 or N+1 configurations, current sharing remains stable across the operating range, reducing imbalance that can accelerate component aging. Component derating and capacitor selection are tuned for high-temperature, high-duty environments, ensuring output consistency over long service lifecycles even in warm or airflow-constrained racks.
PMBus telemetry provides continuous visibility into voltage regulation, load distribution, thermal conditions, and fan behavior, enabling early detection of airflow degradation or load drift and supporting predictive maintenance strategies. For deployments approaching the limits of 1200W or 1300W systems, the G1136-1600WNA delivers additional stability margin without changes to CRPS bay dimensions, making it a practical foundation for future GPU upgrades and workload expansion.
Power Operating Notes
|
Reference Condition |
Suggested Guidance |
| High VM density |
Maintain sufficient headroom |
|
Mixed compute & storage |
Balance load distribution |
| Continuous runtime |
Ensure consistent airflow |
|
Dense chassis deployment |
Monitor internal temperatures |
| Service restart cycles |
Avoid simultaneous power surges |
|
Enterprise environments |
Maintain grounding integrity |
| Long duty cycles |
Schedule routine inspections |
|
Future expansion |
Evaluate parallel scaling strategy |
FAQ
Q1. What type of workloads is G1136-1600WNA designed for?
It is designed for general-purpose server workloads that combine compute, memory, and storage activity, rather than focusing on a single specialized task.
Q2. How does it differ from the 1300W variant?
The 1600W model provides additional headroom for higher VM density and sustained utilization, reducing the likelihood of power constraints as systems scale.
Q3. Is it suitable for continuous 24/7 operation?
Yes. Its electrical and thermal design supports non-stop operation, provided that airflow and environmental conditions are properly maintained.
Q4. Can it support virtualization-heavy environments?
Yes. It supports denser virtualization configurations, especially where multiple services run concurrently across the same platform.
Q5. Is this model appropriate for storage-integrated servers?
It is suitable for moderate storage interaction, such as systems combining compute with local or network-attached storage.
Q6. How does it perform in dense server chassis?
The unit maintains a balanced thermal footprint, making it appropriate for rack-dense enterprise servers.
Q7. Does it allow future scalability?
Yes. It offers room for gradual expansion, though extremely storage- or compute-intensive growth may require platform-level scaling.
Q8. When should an alternative series be considered?
If workloads evolve toward specialized acceleration, very high IO density, or GPU-heavy architectures, transitioning to a more specialized power platform may be more suitable.