G1505-3200WNA – 3200W CRPS Power Supply for AI Training Nodes, Ultra-Dense Data Centers, and Performance-Driven Compute Platforms
Features
CRPS-185: 185×73.5x40mm (LxWxH)
CRPS-265: 265×73.5x40mm (LxWxH)
Input: 90 to 264Vac,180-300VdC
Hot-plug
Full Digital control
Active Power Factor Correction
Intelligent-thermal Fan Control
N+N N+1 Redundant
Reverse Airflow Option
Applications
Server
Storage
Networking
HPC
Edge Computing
Telecom
AI Training
Industrial Automation
Approvals
UL/cUL
CB
TuV-Mark
CCC/CQC
FCC
CE
NOM
BIS
Specifications
| Output Power (W): | 3200 |
| Length (mm): | 185 |
| Width (mm): | 73.5 |
| Height (mm): | 40 |
| Mounting Type: | Hot pluggable |
| Minimum Output Current (A): | 0 |
| Maximum Output Current (A): | 266 |
| Output Voltage (V): | 12 |
| Minimum Output Power (W): | 0 |
| Maximum Output Power (W): | 3200 |
| Minimum Input Voltage (V): | 90 |
| Maximum Input Voltage (V): | 264 |
Model Selection Comparison Table
|
Model |
Power Tier | Behavior | PMBus | Form Factor | Recommended Use |
| G1505-2700WNA | Entry high-capacity | GPU/Compute dense workloads | Yes | CRPS |
HPC / inference clusters |
| Maximum performance | Heavy accelerated compute | Yes | CRPS | AI + multi-node processing | |
| G1508-1600WNA | Mid-high performance | Compute/storage balanced | Yes | CRPS |
Virtualization + inference |
| Large enterprise compute | Heavy AI/HPC | Yes | CRPS |
Multi-GPU, HPC fabrics |
Deployment Scenarios
G1505-3200WNA is the maximum performance watt tier of the G1505 high-density power platform, intended for extreme compute environments running heavy GPU acceleration, multi-node inference, HPC simulation workloads, video transcoding clusters, and database backbones with persistent high IO pressure. This model serves deployments where compute intensity no longer fits comfortably within 2.7KW-class power envelopes, providing operational runway for continuous load cycles in AI-heavy data centers.
The extended power tier is particularly effective in multi-GPU inference tiles, HPC queue scheduling platforms, real-time model-serving fabrics, deep analytics engines, streaming video coders, memory-heavy VM clusters, rendering workloads and high-bandwidth storage replication frameworks. With expanded transient tolerance and clean waveform behavior under concurrency peaks, G1505-3200WNA enables vertical capacity scaling before resorting to multi-PSU parallelization, extending hardware lifetime and improving per-rack efficiency.
|
Scenario |
Workload Behavior | Why 3200W Fits |
| Multi-GPU inference | Burst + sustained |
Extreme transient coverage |
|
HPC scientific workloads |
Long concurrency | High-duty rail integrity |
| Rendering/encoding clusters | Constant throughput |
Reliable thermal buffer |
|
Large DB transaction core |
Intensive commit cycles | Stable low-noise waveform |
| Deep analytics engines | Compute + streaming |
Ripple behavior contained |
|
Heavy VM cloud fabrics |
Multi-tenant high density |
Prevents power ceiling strain |
Power Architecture & Reliability Design
The G1505-3200WNA expands electrical delivery depth to support peak concurrency and multi-accelerator load patterns, preserving voltage stability under near-constant high-duty operation. Its high-current conduction stage maintains waveform integrity during heavy inference execution, queued HPC workloads, and write-intensive commit cycles, while an optimized switching cadence reduces switching loss and limits EMI footprint as utilization approaches saturation.
Thermal architecture is scaled to match this extreme power profile, with widened heat distribution across magnetic stages and capacitance domains to reduce hotspot clustering and maintain uniform discharge behavior. Expanded airflow paths slow capacitor fatigue during prolonged high-utilization cycles, allowing predictable thermal behavior even in densely packed accelerator racks operating near upper environmental limits.
Integrated PMBus telemetry provides lifecycle-level health visibility, tracking runtime voltage drift, ripple trend evolution, fan curve slope changes, and cumulative thermal stress signatures. Spread-spectrum switching and EMI control improve coexistence with dense backplane interconnects and high-frequency accelerator fabrics. As the top-tier wattage within the G1505 family, the 3200W model represents the final vertical scaling step before transitioning to multi-rail or distributed power architectures for extreme compute density.
Power Operating Notes
|
Reference Condition |
Suggested Guidance |
| GPU/Inference clusters |
Maintain strong cold aisle airflow |
|
HPC tasks |
Avoid >90% prolonged saturation |
| Video/Rendering engines |
Monitor fan curve under peak runtime |
|
Transaction-heavy storage |
Check ripple shift post compaction |
| Distributed analytics |
Review PMBus thermal logs monthly |
|
24/7 datacenter duty |
Prevent dust accumulation at intake |
| Multi-node scaling |
Track temperature slope vs utilization |
|
Future expansion |
Parallel PSU or nodes when scaling beyond tier |
FAQ
Q1. When is G1505-3200WNA the correct deployment choice?
When compute fabrics run continuously near load limits and require extreme thermal/electrical overhead.
Q2. Performance gain over 2700W?
More burst absorption, longer stability before saturation, smoother waveform under peak concurrency.
Q3. PMBus support?
Full telemetry visibility for proactive health planning.
Q4. Suitable for sustained 24/7 load?
Engineered for continuous HPC and accelerated workloads.
Q5. GPU inference fit?
Ideal for multi-GPU, large model serving and parallel inferencing.
Q6. Rack density impact?
Maintains thermal linearity for dense node architectures.
Q7. Redundancy?
CRPS-based, N+1 capable for datacenter reliability profiles.
Q8. Beyond 3200W scaling?
Move into multi-PSU node expansion or distributed power lanes.